Adhesives for Electronic Ind

UV Glue
UV Glue

Adhesive for plastics

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
U-3411 80,000 D 65±5 1.09 Metal and plastic
T-398 20,000 D 70±5 1.1 plastic filler
CUV-3411S 2,500 D 65±5 0.96 Metal and plastic
U-383 84,000 D 55±5 0.97 sticky plastic
U-385 7,500 D 70±5 0.9 sticky plastic
U-389 38,000 D60±5 1 Plastic binder (non-silicone)
U-57S3 5,300 D 35±5 0.9 LED adhesion
U-296 12,000 D60±5 1.04 sticky plastic
U-319 300 D 75±5 0.9 PVC/PC adhesion
U-400G 13,000 D60±5 0.9 ultraviolet filler
U-296 12,000 D60±5 1.04 sticky plastic
U-319 300 D 75±5 0.9 PVC/PC adhesion

Cable adhesive

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
U-3615 85,000 D60±5 0.96 PCB Wire Adhesion
U-3054 200 D 40±5 0.9 PVC cable adhesion

Adhesive for metals

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
CUV-1685-2 12,000 D 40±5 0.9 Reinforce the microphone magnet
U-401 50,000 D60±5 0.9 LCP+Ni
U-290 6,000 D 50±5 1 Plastic +

Glass adhesive

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
U-399 20,000 D 65±5 1 Glass glue
U-407 35,000 D 55±5 0.97 C-MOS Adhesion
U-3612G 40,000 D60±5 0.96 PI and glass
U-395 65,000 D60±5 0.9 C-MOS Adhesion
U-396 100 D 65±5 0.6 glasses and glasses
U-346 240 A10 0.9 Glass Protector
U-4051 1,000,000 A10 0.9 UV pressure sensitive glue

Membrane adhesive

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
CUV-1768 1,500 D 70±5 0.97 TPU + diaphragm
U-001 500 D 45±5 0.9 Paper and film adhesion
Epoxy Glue

Heat resistant adhesive

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
EP-4010A 65,000 1.15 100 × 20 min Adhesion to metal, IC and PCB; high-TG; high shear strength
EP-4010A 50,000 1.15 100 × 20 min Adhesion to metal, IC and PCB; high-TG; high shear strength

Adhesive for fixing components

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
EP-3008R 300,000 1.25 150 × 60 seconds “High-speed SMT delivery; used on PCB before spot soldering Adhesion and fixation of SMD components”
EP-3008R1 350,000 1.27 150 × 60 seconds “High-speed SMT delivery; used on PCB before spot soldering Adhesion and fixation of SMD components”
EP-3008R2 380,000 1.27 150 × 60 seconds “High-speed SMT delivery; used on PCB before spot soldering Adhesion and fixation of SMD components”

Low temperature curing adhesive (For metal)

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
EP-3020 120,000 1.15 80 × 20 min Premium metal and magnet adhesion; plastic film

Low Temperature Hardening Adhesive (For Plastic)

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
EP-3008R 300,000 1.25 80 × 20 min LEDs; premium mattress
EP-4025 25,000 1.15 80 × 20 min ABS material; Plastic with low viscosity; Products with low viscosity
EP-4026W 70,000 1.18 80 × 20 min LEDs; plastic film

Adhesive to protect microchip components

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
EP-2030 600 1.10 120 × 20 min Filling for CPS, BGA and micro-BGA assemblies
EP-2033 2200 1.18 120 × 20 min Filling for CPS, BGA and micro-BGA assemblies
EP-2034 3500 1.24 120 × 20 min Filling for CPS, BGA and micro-BGA assemblies

Adhesive for double mixing

Item No. Viscosity (m.Pas) Rate Hardening method Applied Materials
7E22AB A : 12,000 B : 8,000 Dual syringe packaging Two liquids at room temperature “Quick hardening with PC adhesion from 4 to 7 minutes ; flexible film”
4E20AB A : 12,000 B : 1,200   “Two liquids at room temperature 100:60″ “Fast hardening in 5 to 8 minutes packing IC; Outstanding metal adhesion”
4E25AB A : 15,000 B : 10,000 Dual syringe packaging Two liquids at room temperature Excellent adhesion to non-metals, such as titanium and alloys
4E30AB A : 12,000 B : 6,000 Dual syringe packaging Two liquids at room temperature “Fast curing in 20 to 30 minutes Outstanding metal adhesion”

 

Moisture-hardening adhesive

PU glue

Item No. Color Viscosity (m.Pas) Solid Content Surface drying time Applied Materials
U-1262 Series “Transparent Black” 18,000 >95% 20 minutes “Moderate film hardness Outstanding metal adhesion”
U-1264 Series “Transparent Black” 16,000 >95% 20 minutes film; Advanced CCD, CMOS, FPC, FCCL and IC adhesion and reinforcement
U-1264AL blur 6,000 >90% 30 minutes film; Outstanding mobility; Used for bonding and reinforcing FPC, FCCL, and IC
U-1264WLE White 5,000 >90% 10 minutes Used to reinforce the soft panel and glass of the touch panel
U-1264EB Black 16,000 >95% 8 minutes Fast hardening; Used to glue plastic and reinforce IC

*Stored up to six months from date of manufacture (25℃/avoid direct sunlight)

MS Adhesive

Item No. Viscosity (m.Pas) hardness Rate Applied Materials
S181 44,000 D 25 1.1 Metal and plastic transparent filler
S181B(W) 50,000 D30 1.3 Metal and plastic filler
S181B(W)L 35,000 D30 1.3 Metal and plastic filler
S181B(W)LL 15,000 D30 1.3 Metal and plastic filler
SF200 55,000 D60 1.7 UL Flame Retardant Fillers

*Stored up to six months from date of manufacture (25℃/avoid direct sunlight)

SGA

SGA glue

Product No. Viscosity (cps) Initial reaction time (minutes) Main app and special features
PL-5050 serious 3,000~5,000 3.5 minutes Dual liquid center glue
PL-7510 serious 3,000~5,000 3.5 minutes metal glue
PL-9130 serious 200,000 5 minutes Metal and plastic adhesive
Solvent binder

SGA glue

Product No. Viscosity (cps) Initial reaction time (minutes) Main app and special features
PL-5050 serious 3,000~5,000 3.5 minutes Dual liquid center glue
PL-7510 serious 3,000~5,000 3.5 minutes metal glue
PL-9130 serious 200,000 5 minutes Metal and plastic adhesive
Industrial coating materials

SGA glue

Product No. Viscosity (cps) Initial reaction time (minutes) Main app and special features
PL-5050 serious 3,000~5,000 3.5 minutes Dual liquid center glue
PL-7510 serious 3,000~5,000 3.5 minutes metal glue
PL-9130 serious 200,000 5 minutes Metal and plastic adhesive